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heat sinks for electronics packaging [Back to Product List]
Product Description

Almost any heat sink material you specify involves a basic, unavoidable trade-off. Either you trade off high thermal conductivity for a low coefficient of thermal expansion or you sacrifice expansion for conductivity.

However, the high performance heat sink materials from T&D put an end to this trade-off. Because compared to the more limited heat sink materials such as copper, aluminum, our materials offers a better matched rate of thermal expansion and a high thermal conductivity.
Its unique chemical composition is the reason. Our materials are fabricated from tungsten and copper in electronic grade powdered form. Tungsten for strength, rigidity and low controlled coefficient of thermal expansion and copper for high thermal conductivity.
The result: A composite heat sink material that meets the increasingly complex demands of the electronics packaging industry. Without trade-offs.